| Company History | |
| 2002. 12 | Patent for CHIP BONDING Method with TCP and COF |
| 2004. 03 | Exhibition participation with New material as FPCB for PDP in Internepcon(Tokyo Big Sight) |
| 2004. 07 | Established New Flexys Co., Ltd. |
| 2004. 07 | Opened a patent with Method of Chip bonding |
| 2004. 08 | Agreement for a cooperation of Technical interchange with Koukai Denshi |
| 2004. 08 | Registration for a cooperation company of Toshiba(Tokyo) |
| 2004. 08 | Registartion for a cooperation company of OKI Printed Circuit(Japan Nihikata) |
| 2004. 08 | Patent registration for Method of CHIP BONDING with TCP & COF |
| 2004. 09 | Technology transfer for PDP COF BONDING Method |
| 2004. 09 | Establishment confirmation as the Lab for the next generation core parts in Flexys |
| 2004. 10 | Registration of Trading company in KITA(Korea International Trade Association) |
| 2004. 10 | Dispatched a sample to Toukai Denshi |
| 2004. 10 | Dispatched a sample for the mass production to OPC(OKI Printed Circuit) |
| 2004. 10 | Agreement for Consultation of COF BONDING technology |
| 2004. 11 | Registation of Venture Company |
| 2004. 11 | New technology Competition Reinforcement Project with Hanyang univ. |
| 2004. 12 | Confirmation of ISO 9001 |
| 2005. 01 | Established the branch of Flexys Japan |
| 2005. 05 | Establish the branch of China |
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